- MBA, National Central University
- Marketing & Technical Supporting Manager, Pfeiffer Vacuum
- Engineer at TSMC
Subject: Hazard Waste Gas Prevention at High-end Semiconductor Process
- It has been seeing that semiconductor technology getting more developed and then causing the IC diameter to be more narrow/precise, process condition is threatened more seriously by waste gas contamination.
- Single wafer cleaning is relied on more application as CVD and Etching; it could be key subject to discuss how preventing mixture gas contamination to impact atmosphere and atmosphere quality inside clean room both.